Intel is seeking a Silicon Packaging Architect to design end-to-end package solutions meeting electrical, mechanical, thermal and cost targets. You will oversee design through production readiness, working with silicon, hardware and manufacturing teams to enable tape-out readiness in a hybrid work model.
Qualified candidates bring 9+ years in semiconductor packaging or a related field, strong DFM/DOE expertise, and proven ability to lead cross-functional efforts across US locations, including
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...Packaging / Container Design EngineerAs a Packaging / Container Design Engineer, you will be responsible for designing, improving, and implementing automotive packaging solutions that support efficient material flow throughout the manufacturing process. You will evaluate...